Under effects of temperature field

acceleration load and their coupling

deflection and stress of semiconductor silicon-based composite film cantilever will change. When the equipment is under heating condition

the temperature of itself will rise as well as thermal stress and strain will be generated. Due to the differences between expansion coefficients of films

small expansion coefficient of film is experienced pulling force

however

big one is experienced pressure force. Finally

the freedom of the cantilever will bend to the direction of the small linear expansion coefficient film

causing the deflection of the bended cantilever changes. when the bended cantilever in the effection of accelerations in Z aix direction

the deflection of the bended cantilever will also be changed. By ABAQUS simulation

the value of the displacement about bended cantilever in different physical fields are given. The conclusion provides a theoretical basis for the appliance of the device which used semiconductor silicon cantilever bending composite films.