Research on glass paste vacuum packaging MEMS device technology

because control condition of glass paste bonding process is relatively complex

improper bonding easily lead to leakage. Using a variety of microscopy: optical microscopy

ultrasound microscopy

laser microscopy

electron microscopy to observe on various stages of glass paste morphology

analyze on effect of printing way

pretreatment conditions

and bonding process on air tightness of bonding. Several influential factors of air tightness of bonding are proposed

which has a very important guiding significance for controlling glass paste bonding process conditions.