To address the problem that Pt film resistance temperature detector (Pt-RTD) requires secondary encapsulation during temperature measurement

an epoxy encapsulated Pt-RTD is developed.Insulated wires are directly connected to the Pt-RTD chip

and encapsulation is achieved by coating and curing with thermally conductive silicone and epoxy resin to form an integrated structure for temperature measurement.The performance parameters of the epoxyencapsulated Pt-RTD are as follows:resistance at 0℃(

R

0

)is(1000±0.4)Ω

temper

ature coefficient of resistance(TCR)is(3851±4)×10

-6

/℃

measurement range is(-50~150)℃

measurement accuracy is better than 0.1℃

stability is better than 0.001℃

and 0℃ resistance drift after 30 days of storage at 150℃ is less than 0.01%

R

0

.Experimental results demonstrate that the prepared epoxyencapsulated Pt-RTD has the advantages of high temperature measurement accuracy and good stability.The epoxy resin encapsulation structure

where insulated wires are directly connected to the chip

can be directly used for temperature measurement without secondary encapsulation

making the product easy to use and low in application cost.It shows broad application prospects in fields such as industrial control

new energy

and intelligent manufacturing.