GUAN Ke, WU Yewei, WU Mingming, et al. Research on the copper busbar structure of current sensor based on coreless technology[J]. 2026, 45(2): 23-27.DOI:
Aiming at the issue that the chip installation position error significantly affects the current measurement accuracy of current sensors based on through-hole coreless technology when measuring copper busbar current
a design scheme for optimizing the busbar cross-section structure of the current sensor is proposed.The structural parameters of the copper busbar are analyzed
and electromagnetic simulation technology is adopted to establish a magnetic field analysis model of the current-carrying busbar. The validity and reliability of the model are verified through a self-built test platform.The results indicate that the wide-gap copper busbar structure exhibits the highest tolerance to chip installation errors
which can reduce the impact of installation errors on measurement accuracy.To meet a measurement accuracy of ±0.5%
the installation error must not exceed 0.17mm. The study provides a theoretical basis and technical support for the development of coreless current sensors.