The performance and reliability of the micro-differential pressure sensitive core are greatly affected by its process. In order to improve the accuracy and stability of the sensor

research on the fabrication and packaging process of a highly reliable and high-precision micro-differential pressure-sensitive core is carried out. In view of the challenges in fabricating the sensitive structure of the resonant differential pressure core

a complete set of fabrication process studies is designed and conducted

and key processes such as high aspect ratio etching

multi-layer wafer-level vacuum bonding

and low residual stress bonding are demonstrated in detail to achieve high-quality structures and improve long-term stability;to address stability issues such as stress isolation

mechanical strength

and electrode leads during chip packaging

research on the packaging process of resonant differential pressure sensitive core is expanded

and packaging processes such as anodic bonding between the chip and borosilicate glass eutectic bonding between the base and borosilicate glassare discussed in detail.By matching the thermal expansion coefficient of the materials

packaging stress is reduced

the mechanical connection between the chip and the base is completed

the connection strength between the chip and the base is ensured

and low stress

high stability and high reliability packaging is achieved.